Void Tracking in SiC Particle Reinforced Al

Wolfgang Altendorfer
Void Tracking in SiC Particle Reinforced Al
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Abstract

The expansion behavior of particulate reinforced AlSiC metal matrix composites (MMCs) during a thermal cycle shows anomalies at temperatures above 250°C, explained by viscoplastic matrix deformations and changing void volume fractions. Volumetric images of the sample acquired by synchrotron tomography at several temperatures between 30°C and 400°C are used to analyze the void kinetics. These high-resolution low-contrast 3D + T images are not aligned, thus only allowing quantitative comparisons over areas comprising many voids. Analysis of speci c voids at various temperatures was not feasible, due to the three-dimensional misalignment. We present a 3D registration approach based on mutual information that allows for sub-pixel accurate registration. A maximum intensity projection (MIP) may be used for a manual pre-alignment. Further software tools for the analysis of void kinetics of AlSiC provide linked views for 2D slices, 3D isosurfaces, volume rendering, as well as overlaid contours (isolines) of multiple images on an arbitrarily positionable cutting plane, and the calculation of a shape factor. By registering the volumetric datasets, we were able to visualize the shrinkage and expansion of a speci c void during thermal cycling between room temperature and 400°C and to analyze the change of quantitative properties of speci c voids{including volume, surface, shape factor|resulting from temperature changes.

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@mastersthesis{altendorfer-2008-vts,
  title =      "Void Tracking in SiC Particle Reinforced Al",
  author =     "Wolfgang Altendorfer",
  year =       "2008",
  abstract =   "The expansion behavior of particulate reinforced AlSiC metal
               matrix composites (MMCs) during a thermal cycle shows
               anomalies at temperatures above 250°C, explained by
               viscoplastic matrix deformations and changing void volume
               fractions. Volumetric images of the sample acquired by
               synchrotron tomography at several temperatures between
               30°C and 400°C are used to analyze the void kinetics.
               These high-resolution low-contrast 3D + T images are not
               aligned, thus only allowing quantitative comparisons over
               areas comprising many voids. Analysis of specic voids at
               various temperatures was not feasible, due to the
               three-dimensional misalignment. We present a 3D registration
               approach based on mutual information that allows for
               sub-pixel accurate registration. A maximum intensity
               projection (MIP) may be used for a manual pre-alignment.
               Further software tools for the analysis of void kinetics of
               AlSiC provide linked views for 2D slices, 3D isosurfaces,
               volume rendering, as well as overlaid contours (isolines) of
               multiple images on an arbitrarily positionable cutting
               plane, and the calculation of a shape factor. By registering
               the volumetric datasets, we were able to visualize the
               shrinkage and expansion of a specic void during thermal
               cycling between room temperature and 400°C and to analyze
               the change of quantitative properties of specic
               voids{including volume, surface, shape factor|resulting from
               temperature changes.",
  address =    "Favoritenstrasse 9-11/186, A-1040 Vienna, Austria",
  school =     "Institute of Computer Graphics and Algorithms, Vienna
               University of Technology",
  month =      mar,
  URL =        "http://www.cg.tuwien.ac.at/research/publications/2008/altendorfer-2008-vts/",
}